FILL is exhibiting its MULTILAYER machine at the JEC World Paris on the exhibition stand – Pavillon 5, Q57. Boost 4.0 big data solutions will also be in the spotlight. Boost 4.0 FILL pilot with SYNCROMILL C will be one of the PoC in the presentation. In FILL´s scenario of the factory for the future, engineering process will drive decision-making based on model-based and data from multiple sources. FILL is on its way to becoming the leading smart machine builder, integrating digital business insights from the whole product value chain, hence maximizing the business impacts.

Apart from our demo, it’s the 10th time for FILL to showcase its world premiere solution, MULTILAYER, in laying thermoplastic tapes with extreme velocity and strong reliability, revolutionizing the lightweight construction industry. MULTILAYER provides an efficient solution to produce high-strength injection-molded parts for industries like automotive, aviation and aerospace. It is one of the most sought-after patented innovation solutions in smart lightweight manufacturing nowadays.

More information about Boost 4.0 and our pilot with FILL, come and collect some flyers at Pavillon 5, Q57. See you at JEC World Paris!